Semiconductor Wafer Processing

>> YOUR LINK HERE: ___ http://youtube.com/watch?v=EFGom2z4mlQ

Logitech offer a full system solution for the preparation of semiconductor wafers to high specification surface finishes prepared with precise geometric accuracy. • This video offers a step by step guide from measuring the initial thickness of the sample to safely bonding fragile wafers to a substrate for processing. The video also includes lapping, polishing and the measurement of the finished sample to safely de-bonding the sample from the substrate. • For more information visit our website: https://logitech.uk.com/ • Or email us: [email protected]

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