This is PacTech Packaging Technology Advanced Packaging Equipment and Wafer Level Packaging

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High-end packaging technology requires precision, attention to detail, innovation and dedication.PacTech is your global provider for advanced packaging solut...

solder repair, Reflow, Solder Rework, BGA reballing, Chip bonding, Microelectronics, Spin coating, Wafer level reflow, solder reballing, wafer processing Solder Packaging, flip chip assembly, Solder ball attach, solder ball removal, flip chip soldering, wafer bumping, Wafer Grinding, Flip chip bonding, Wafer Dicing, Capacitor bonding, Diode bonding, MEMS bonding, Solder jetting, Solder Ball, Wafer Plating, Wafer Level Packaging, Solder Bump, Wafer level rework
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