BGA Underfilling

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http://youtube.com/watch?v=Y4u8OVXgmGU

This video demonstrates BEST capabilities for low volume underfilling. Underfills are used to increase the device resistance to shock or drop failures. We have experience with a variety of underfills including capillary action underfills. BEST has the capability to underfill hundreds of devices using either a volumetrically controlled underfill or robotic dispense process. • See more on these BGA rework, repair and assembly services: • http://www.solder.net/services/bga-re...

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