Warped Semiconductor Wafer Handling Automation Demo











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Our WaferMate Series Automated wafer handling platform delivers wafer handling for standard and non-standard wafers and substrates. • This automated wafer handling system was integrated with a DEK printer process tool and demonstrates the handling of 200mm warped wafers. It features an aligner station and transfer station with 6 lift pins designed for the handling of fragile warped wafers. • System Specs: • • 200mm (4mm thick) Wafers • • Transfer station to DEK Printer • • Pallet with 6 lift pins • • Aligner Station • Interested in learning more about our wafer handling capabilities? • Visit our website to learn more: • https://bit.ly/3rQIKyM • Timeline: • 0:00 Warped Semiconductor Wafer Handling System • 0:07 Open Cassette Wafer Mapping • 0:37 Vacuum Grip Aligner • 1:11 Wafer Handoff to Process Tool • 1:30 Wafer Loading into Output Cassette • 1:51 Wafer Pickup from Aligner • 1:55 Wafer Handoff to Process Tool • 2:11 Wafer Pickup from Transfer Station • 2:14 Wafer Loading into Output Cassette • 2:26 Wafer Alignment Process • 2:34 Wafer Pickup from Aligner • 2:37 Wafer Handoff to Process Tool • 2:53 Wafer Pickup from Transfer Station • 2:56 Wafer Loading into Output Cassette

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