HiRel Wire Bonding Ball Bumps FABs Chain Bonding and Complex Looping Profiles

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Download the 8000i Wire Bonder/Ball Bumper data sheet: http://www.palomartechnologies.com/80... • The 8000i Wire Bonder is a fully-automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

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