Trion ICP RIE Dry Etch Standard Operating Procedures

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View the SOP documentation • http://www.inrf.uci.edu/sop-trion/ • The Trion etcher is load lock equipped and operated via a touch screen interface. The user may employ either RIE (Reactive Ion Etching) RF power applied at the sample stage or ICP (Inductively Coupled Plasma) RF power applied at the shower head above the sample stage. The system is configured to use both chlorinated and fluorinated gases to perform a wide variety of etch recipes.

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