CoWoS打造產業神山

YOUR LINK HERE:

http://youtube.com/watch?v=x6MDSKVTGZg

#TSV #CoWoS #台積電 #3D封裝 #interposer • 了解CoWoS先進封裝與傳統封裝測試的不同後，想必觀眾有了SoC、SoIC、IC封裝的概念。 • 進階延伸為何先進封裝會出現2.5D與3D封裝不同維度的發展呢？晶片如何透過垂直互聯、傳接訊號？這當中使用哪些技術？ • CoWoS的關鍵零組件與製程其實與上述問題息息相關，就讓半導體專家林嘉洤教授，和金融行銷專家馬瑞辰教授在影片中替你解答！ • After understanding the differences between advanced packaging like CoWoS and traditional packaging testing, viewers likely have a grasp of concepts like SoC, SoIC, and IC packaging. • A more advanced extension: why has advanced packaging seen developments in 2.5D and 3D packaging dimensions? How do chips transmit signals through vertical interconnects and routing? What technologies are involved? • The critical components and processes of CoWoS are closely related to these questions. Let semiconductor expert Professor Lin Jiatong and financial marketing expert Professor Ma Ruichen provide answers in the video! • 【先進封裝供應鏈】Advanced packaging supply chain • 【上游】設備供應商/載板/探針/中介層 Upstream(Equipment suppliers / substrates / probes / interposers) • 萬潤(6187)、弘塑(3131)、新耘(3583)、均華(6640)、 • 均豪(5443)、志聖(2467)、致茂(2360)、欣興(3037)、 • 雍智(6683)、旺矽(6223)、精測(6510)、穎崴(6515)、 • 聯電(2303) • 【中游】封裝 Midstream(Packaging) • 台積電(2330)、日月光(3711)、台星科(3265) • 【下游】：測試 Downstream(Testing) • 京元電(2449)、矽格(6257) • 【發財二極體相關平台】 • YouTube頻道：https://www.youtube.com/channel/UCVrP • FB粉絲頁：https://www.facebook.com/ • 【聯絡我們】 • email: [email protected]

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