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UberCool Lidless Packages with Xilinx Versal ACAPs
>> YOUR LINK HERE: ___ http://youtube.com/watch?v=CFRo3UHojfQ
Have you seen the state-of-the-art in silicon chip packaging technology? The new lidless packages used with Versal ACAPs (Adaptive Compute Acceleration Platforms) and other FPGAs, SoCs, MPSoCs, and RFSoC's from Xilinx are cool in more ways than one (see also the associated column at https://www.clivemaxfield.com/uber-co.... In addition to being cool to look at, they can also reduce junction temperature by 28C at an ambient temperature of 45C) as compared to a traditional lidded package with a thermal pad. Color me impressed!
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