25 D amp 3D Chips Interposers and Through Silicon Vias

>> YOUR LINK HERE: ___ http://youtube.com/watch?v=L7ojK4U67Ik

Advantages of 3D/2.5D chips. Challenges in making 3D chips using Through Silicon Via (TSV)Stanford University's class on nanomanufacturing, led by Aneesh Nai...

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